Using waveform engineering to understand the impact of harmonic terminations during 5:1 VSWR stress tests

Loescher, David, Tasker, Paul ORCID: https://orcid.org/0000-0002-6760-7830 and Cripps, Stephen ORCID: https://orcid.org/0000-0002-2258-951X 2016. Using waveform engineering to understand the impact of harmonic terminations during 5:1 VSWR stress tests. Presented at: Power Amplifiers for Wireless and Radio Applications (PAWR), 2016 IEEE Topical Conference on, Austin, TX, USA, 24-27 Jan. 2016. 2016 IEEE Topical Conference on Power Amplifiers for Wireless and Radio Applications (PAWR). IEEE, pp. 49-52. 10.1109/PAWR.2016.7440161

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Abstract

There are many applications where the operational environment of the antenna is challenging, which means its impedance can be highly variable, so the RF PA needs to be able to operate over a wide variety of loads without stress or failure. Assessing this is a key requirement of reliability testing, with VSWR sweeps being a typical way to test this durability. It is important to make sure the amount of information gained from these sweeps is maximized, so adding RF I-V waveform information can help give a more accurate view of what is occurring at the current generator plane. Also if the fundamental and second harmonic loads are systematically swept significant voltage stress, possibly not seen during the current conventional VSWR tests, is observed, which has implications in both the output matching network design and the current method of testing

Item Type:	Conference or Workshop Item (Paper)
Date Type:	Publication
Status:	Published
Schools:	Engineering
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Uncontrolled Keywords:	Radio frequency, Harmonic analysis, Stress, Impedance, Transistors, Reliability, Testing
Publisher:	IEEE
ISBN:	978-1-5090-1685-3
Last Modified:	21 Nov 2022 07:48
URI:	https://orca.cardiff.ac.uk/id/eprint/104093

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