Hot deformation behavior and processing maps of diamond/Cu composites

Zhang, Hongdi, Liu, Yue, Zhang, Fan, Zhang, Di, Zhu, Hanxing ORCID: https://orcid.org/0000-0002-3209-6831 and Fan, Tongxiang 2018. Hot deformation behavior and processing maps of diamond/Cu composites. Metallurgical and Materials Transactions A 49 (6) , pp. 2202-2212. 10.1007/s11661-018-4547-x

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Abstract

The hot deformation behaviors of 50 vol pct uncoated and Cr-coated diamond/Cu composites were investigated using hot isothermal compression tests under the temperature and strain rate ranging from 1073 K to 1273 K (800 C to 1000 C) and from 0.001 to 5 s1, respectively. Dynamic recrystallization was determined to be the primary restoration mechanism during deformation. The Cr3C2 coating enhanced the interfacial bonding and resulted in a larger flow stress for the Cr-coated diamond/Cu composites. Moreover, the enhanced interfacial affinity led to a higher activation energy for the Cr-coated diamond/Cu composites (238 kJ/mol) than for their uncoated counterparts (205 kJ/mol). The strain-rate-dependent constitutive equations of the diamond/Cu composites were derived based on the Arrhenius model, and a high correlation (R = 0.99) was observed between the calculated flow stresses and experimental data. With the help of processing maps, hot extrusions were realized at 1123 K/0.01 s1 and 1153 K/0.01 s1 (850 C/0.01 s1 and 880 C/0.01 s1) for the uncoated and coated diamond/Cu composites, respectively. The combination of interface optimization and hot extrusion led to increases of the density and thermal conductivity, thereby providing a promising route for the fabrication of diamond/Cu composites.

Item Type:	Article
Date Type:	Publication
Status:	Published
Schools:	Engineering
Publisher:	ASM International
ISSN:	1073-5623
Date of First Compliant Deposit:	12 April 2018
Date of Acceptance:	29 January 2018
Last Modified:	29 Nov 2024 02:30
URI:	https://orca.cardiff.ac.uk/id/eprint/110542

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