Contact resistance of various metallisation schemes to superconducting boron doped diamond between 1.9 and 300 K

Manifold, Scott A., Klemencic, Georgina ORCID: https://orcid.org/0000-0002-2125-9754, Thomas, Evan L.H., Mandal, Soumen ORCID: https://orcid.org/0000-0001-8912-1439, Bland, Henry, Giblin, Sean R. ORCID: https://orcid.org/0000-0003-1876-8619 and Williams, Oliver A. ORCID: https://orcid.org/0000-0002-7210-3004 2021. Contact resistance of various metallisation schemes to superconducting boron doped diamond between 1.9 and 300 K. Carbon 179 , pp. 13-19. 10.1016/j.carbon.2021.02.079

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Abstract

Diamond is a material that offers potential in numerous device applications. In particular, highly boron doped diamond is attractive due to its superconductivity and high Young’s Modulus. The fabrication of stable, low resistance, ohmic contacts is essential to ensure proper device function. Previous work has established the efficacy of several methods of forming suitable contacts to diamond at room temperature and above, including carbide forming and carbon soluble metallisation schemes. Herein, the stability of several contact schemes (Ti, Cr, Mo, Ta and Pd) to highly boron doped nanocrystalline diamond was verified down to the cryogenic temperatures with modified Transmission Line Model (TLM) measurements. While all contact schemes remained ohmic, a significant temperature dependency is noted at Tc and at the lowest temperatures the contact resistances ranged from Ti/Pt/Au with (8.83±0.10)×10-4 Ω.cm to Ta/Pt/Au with (8.07±0.62)×10-6 Ω.cm.

Item Type:	Article
Date Type:	Publication
Status:	Published
Schools:	Physics and Astronomy
Publisher:	Elsevier
ISSN:	0008-6223
Date of First Compliant Deposit:	4 March 2021
Date of Acceptance:	22 February 2021
Last Modified:	06 Nov 2024 12:30
URI:	https://orca.cardiff.ac.uk/id/eprint/139301

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