Nanostructuring enforced sandwich-tubular CNT-Cu interconnects

Wang, Pengjie, Cao, Qiang, Lan, Yucheng, Zhu, Hanxing ORCID: https://orcid.org/0000-0002-3209-6831, Liu, Sheng and Peng, Qing 2021. Nanostructuring enforced sandwich-tubular CNT-Cu interconnects. Composite Structures 278 , 114705. 10.1016/j.compstruct.2021.114705

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Abstract

The miniaturization of microchips requires high strength and conductivity of nanoscale interconnects. With utmost mechanical strength, carbon nanotubes (CNTs) are a common reinforcement. An open issue is how to improve the mechanical strength of CNT-metal composites in nanoscale. Here, via structure engineering, we introduce a novel CNT-sandwiched tubular copper nanocomposite. Theoretical enhancement factor referring to 5-nm-wire copper is approximately 4, 10, and 6 folds for Young’s modulus, ultimate tensile strength, and tensile toughness, respectively, using single-walled CNT reinforcers. The enhancement can be further increased with the number of walls of CNT, as well as the reduction of the cross-section size. The reinforcement is proportional to CNT volume fraction, which is higher than that of conventional Halpin-Tsai model, up to 2 times. Even at the high temperature of 900 K, the nanocomposite structure still has a considerably high Young’s modulus (219.8 GPa), ultimate tensile strength (26.0 GPa) and tensile toughness (2.22 GJ m−3), suggesting advanced high-temperature applications. Vibration density of state analysis reveals the origin of the enhancement and the change of Csingle bondC bonds state during tensile process. The abnormally high reinforcement suggests the essential role of nanostructure engineering.

Item Type:	Article
Date Type:	Publication
Status:	Published
Schools:	Engineering
Publisher:	Elsevier
ISSN:	0263-8223
Date of First Compliant Deposit:	29 September 2021
Date of Acceptance:	18 September 2021
Last Modified:	10 Nov 2022 09:48
URI:	https://orca.cardiff.ac.uk/id/eprint/144538

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