Enhancing high-power-density converter design: A data-driven analysis of MOSFET and heatsink selection

Jin, Tian, Ming, Wenlong ORCID: https://orcid.org/0000-0003-1780-7292, Feng, Zhengyang, Kumar, Manish and Wang, Sheng ORCID: https://orcid.org/0000-0002-2258-2633 2024. Enhancing high-power-density converter design: A data-driven analysis of MOSFET and heatsink selection. Presented at: 2024 IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe (WiPDA Europe), Cardiff, UK, 16-18 September 2024. 2024 IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe (WiPDA Europe). IEEE, 10.1109/wipdaeurope62087.2024.10797340 Item availability restricted.

PDF - Accepted Post-Print Version Restricted to Repository staff only until 20 February 2025 due to copyright restrictions. Download (972kB)

Abstract

MOSFETs are commonly used switching devices in high-power-density converters thanks to their fast-switching frequency. However, their on-state resistance and high switching frequency result in undesirable heat dissipation, which leads to thermal management challenges. To prevent device overheating, failure, and safety hazards, heatsinks for cooling are essential. This study aims to address the optimal combined selection of MOSFETs and heatsinks for designing high-power-density converters by analyzing extensive MOSFET and heatsink data from electronics distributors and utilizing data imputation to handle missing data related to MOSFET and heatsink specifications. This paper establishes a comprehensive data-driven model, supported by data imputation, that estimates the converters' power dissipation and temperature of MOSFETs and heatsinks based on design parameters including voltage levels, current levels, costs, and volumes. Predicting power dissipation and junction temperature under varying design parameters aids engineers in making suitable choices during the practical design process.

Item Type:	Conference or Workshop Item (Paper)
Date Type:	Published Online
Status:	Published
Schools:	Engineering
Publisher:	IEEE
Date of First Compliant Deposit:	20 January 2025
Last Modified:	20 Jan 2025 12:30
URI:	https://orca.cardiff.ac.uk/id/eprint/175265

Actions (repository staff only)

Edit Item