Experimental evaluation of an active envelope load pull architecture for high speed device characterization

Williams, Tudor, Tasker, Paul J. ORCID: https://orcid.org/0000-0002-6760-7830 and Benedikt, Johannes ORCID: https://orcid.org/0000-0002-9583-2349 2005. Experimental evaluation of an active envelope load pull architecture for high speed device characterization. Presented at: IEEE MTT-S International Microwave Symposium Digest 2005, IEEE, 10.1109/MWSYM.2005.1516980

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Abstract

This paper presents a solution to the iterative nature of load pull characterization of transistor power performance. This has been achieved using a novel load pull architecture with a feedback loop at envelope frequencies within an active load pull system, which has been demonstrated and evaluated for single tone excitation. Furthermore employing the new architecture, a novel application is demonstrated which could be potentially useful in production environments, this is achieved using an amplitude modulated stimulus that reduces measurement time from hours to seconds.

Item Type:	Conference or Workshop Item (Paper)
Date Type:	Publication
Status:	Published
Schools:	Engineering
Uncontrolled Keywords:	Load Pull ; Power Amplifiers ; Device Characterization ; Waveform measurements
Additional Information:	Microwave Symposium Digest, 2005 IEEE MTT-S International 12-17 June 2005 Page(s):4 pp.
Publisher:	IEEE
ISSN:	0149-645X
Last Modified:	17 Oct 2022 09:03
URI:	https://orca.cardiff.ac.uk/id/eprint/1912

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