Dielectric constant reduction using porous substrates in finline millimetre and submillimetre detectors

North, Christopher E., Audley, M. D., Glowacka, D. M., Goldie, D., Grimes, P. K., Johnson, B. R., Maffei, B., Melhuish, S. J., Piccirillo, L., Pisano, G., Tsaneva, V. N., Withington, S. and Yassin, G. 2008. Dielectric constant reduction using porous substrates in finline millimetre and submillimetre detectors. Presented at: Millimeter and Submillimeter Detectors and Instrumentation for Astronomy IV, Marseille, France, 26-28 June 2008. Published in: Duncan, W. D., Holland, W. S., Withington, S. and Zmuidzinas, S. eds. Millimeter and Submillimeter Detectors and Instrumentation for Astronomy IV (Proceedings Volume): 26-28 June 2008, Marseille, France. Proceedings of SPIE (7020) Bellingham, WA: SPIE - The International Society for Optical Engineering, G202. 10.1117/12.788479

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Abstract

Finlines are planar structures which allow broadband and low loss transition from waveguide to planar circuits. Their planar structure and large substrate makes them ideal for integration with other planar circuits and components, allowing the development of an on chip polarimeter. We have developed a method of extending the employment of finlines to thick substrates with high dielectric constants by drilling or etching small holes into the substrate, lowering the effective dielectric constant. We present the results of scale model measurements at 15GHz and cryogenic measurements at 90GHz which illustrate the excellent performance of finline transitions with porous substrates and the suitability of this technique for extending the bandwidth of finline transitions.

Item Type:	Conference or Workshop Item (Paper)
Date Type:	Publication
Status:	Published
Schools:	Physics and Astronomy
Subjects:	Q Science > QB Astronomy Q Science > QC Physics
Additional Information:	Article no. 70202G
Publisher:	SPIE - The International Society for Optical Engineering
ISBN:	9780819472304
Last Modified:	04 Jun 2017 03:31
URI:	https://orca.cardiff.ac.uk/id/eprint/22411

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