Influence of the microstructure on the stress state of solder joints during thermal cycling

Menk, A. and Bordas, Stephane Pierre Alain ORCID: https://orcid.org/0000-0001-8634-7002 2009. Influence of the microstructure on the stress state of solder joints during thermal cycling. Presented at: EuroSimE 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2009, Delft, Netherlands, 26-29 April 2009. 10th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) :proceedings of a meeting held 26-29 April 2009, Delft, Netherlands. Institute of Electrical and Electronics Engineers, pp. 570-574.

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Item Type:	Conference or Workshop Item (Paper)
Status:	Published
Schools:	Engineering
Publisher:	Institute of Electrical and Electronics Engineers
ISBN:	9781424441600
Related URLs:	http://ieeexplore.ieee.org/servlet/opac?...
Last Modified:	20 Oct 2022 09:21
URI:	https://orca.cardiff.ac.uk/id/eprint/31595

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