Wideband compact planar balun for applications in outphasing and push-pull amplifiers

Bogusz, Aleksander, Lees, Jonathan ORCID: https://orcid.org/0000-0002-6217-7552, Quaglia, Roberto ORCID: https://orcid.org/0000-0003-3228-301X, Watkins, Gareth and Cripps, Steve ORCID: https://orcid.org/0000-0002-2258-951X 2019. Wideband compact planar balun for applications in outphasing and push-pull amplifiers. Electronics Letters 55 (16) , pp. 912-914. 10.1049/el.2018.7915

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Abstract

This Letter presents a novel approach to realising and fabricating a planar balun structure, where conventional bond wires are replaced by conductor bridges supported on polyimide blocks. Three different prototype structures were fabricated on 10 mil thick alumina substrate ( ɛ r = 9.8, tan δ = 0.0001) using thin film fabrication technology. More than double octave bandwidths are reported, from 1.25 to 4.7 GHz with losses lower than 1 dB, an amplitude imbalance (trace separation) below 0.75 dB and phase imbalance within ±5°. Measurements show good agreement with simplified 2D EM simulations. The performance of the balun is assessed for suitability in applications where amplitude and phase balance are of critical importance, such as push–pull or outphasing amplifier topologies.

Item Type:	Article
Date Type:	Publication
Status:	Published
Schools:	Engineering
Publisher:	Institution of Engineering and Technology (IET)
ISSN:	0013-5194
Date of First Compliant Deposit:	19 March 2019
Date of Acceptance:	7 March 2019
Last Modified:	11 Nov 2024 16:30
URI:	https://orca.cardiff.ac.uk/id/eprint/120931

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