Comparative study of initial stages of copper immersion deposition on bulk and porous silicon

Bandarenka, Hanna ORCID: https://orcid.org/0000-0003-4254-8261, Prischepa, Sergey L., Fittipaldi, Rosalba, Vecchione, Antonio, Nenzi, Paolo, Balucani, Marco and Bondarenko, Vitaly 2013. Comparative study of initial stages of copper immersion deposition on bulk and porous silicon. Nanoscale Research Letters 8 (1) , 85. 10.1186/1556-276X-8-85

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Abstract

Initial stages of Cu immersion deposition in the presence of hydrofluoric acid on bulk and porous silicon were studied. Cu was found to deposit both on bulk and porous silicon as a layer of nanoparticles which grew according to the Volmer-Weber mechanism. It was revealed that at the initial stages of immersion deposition, Cu nanoparticles consisted of crystals with a maximum size of 10 nm and inherited the orientation of the original silicon substrate. Deposited Cu nanoparticles were found to be partially oxidized to Cu2O while CuO was not detected for all samples. In contrast to porous silicon, the crystal orientation of the original silicon substrate significantly affected the sizes, density, and oxidation level of Cu nanoparticles deposited on bulk silicon.

Item Type:	Article
Date Type:	Publication
Status:	Published
Schools:	Schools > Physics and Astronomy
Publisher:	SpringerOpen
ISSN:	1556-276X
Date of First Compliant Deposit:	31 July 2026
Date of Acceptance:	28 January 2013
Last Modified:	07 Sep 2026 21:56
URI:	https://orca.cardiff.ac.uk/id/eprint/188577

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