Cu-Si nanocomposites based on porous silicon matrix

Bandarenka, Hanna ORCID: https://orcid.org/0000-0003-4254-8261, Shapel, Aliaksandr and Balucani, Marco 2009. Cu-Si nanocomposites based on porous silicon matrix. Solid State Phenomena 151 , pp. 222-229. 10.4028/www.scientific.net/SSP.151.222

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Abstract

Cu-Si nanocomposites formed by an immersion displacement deposition of Cu into porous silicon (PS) matrix have been experimentally studied. SEM and AES were used to investigate the structure and elemental composition of Cu-Si samples. The top part of the Cu-PS samples is shown to demonstrate the following structure: large faceted Cu grains at the top, a porous fine-grained copper film underneath the large grains, and the copper pointed rods extended from the surface into the PS layer. The top part of the silicon skeleton of the PS layer is converted into the copper by the etching followed by Cu displacement deposition. The porosity of the porous layer and displacement deposition times are found to form Cu-Si nanocomposites of various structures and various Cu-Si contents because of various extent of the silicon skeleton transformation into copper.

Item Type:	Article
Date Type:	Publication
Status:	Published
Schools:	Schools > Physics and Astronomy
Publisher:	Trans Tech Publications
ISSN:	1662-9779
Last Modified:	07 Sep 2026 21:56
URI:	https://orca.cardiff.ac.uk/id/eprint/188582

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