| Eblabla, Abdalla Mohamed  ORCID: https://orcid.org/0000-0002-5991-892X, Li, Xu, Wallis, David J  ORCID: https://orcid.org/0000-0002-0475-7583, Guiney, Ivor and Elgaid, Khaled  ORCID: https://orcid.org/0000-0003-3265-1097
      2017.
      
      GaN on low-resistivity silicon THz high-Q passive device technology.
      IEEE Transactions on Terahertz Science & Technology
      7
      
        (1)
      
      , pp. 93-97.
      
      10.1109/TTHZ.2016.2618751 Item availability restricted. | 
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Abstract
In this paper, viable transmission media technology has been demonstrated for the first time on GaN on low-resistivity silicon) substrates (ρ <; 40 Ω·cm) at H-band frequencies (220-325 GHz). The shielded-elevated coplanar waveguide (CPW) lines employ a standard monolithic microwave integrated circuit compatible air bridge process to elevate the CPW traces above a 5-μm layer of benzocyclobutene on shielded metalized ground plates. An insertion loss of less than 2.3 dB/mm was achieved up to 325 GHz, compared with 27 dB/mm for CPW fabricated directly on the substrate. To prove the efficiency of the technology, a short-circuited stub filter with a resonant frequency of 244 GHz was used. The filter achieved an unloaded Q-factor of 28, along with an insertion loss of 0.35 dB and a return loss of - 34 dB. To our knowledge, these results are the best reported to date for GaN-based technology.
| Item Type: | Article | 
|---|---|
| Date Type: | Publication | 
| Status: | Published | 
| Schools: | Schools > Engineering | 
| Publisher: | Institute of Electrical and Electronics Engineers (IEEE) | 
| ISSN: | 2156-342X | 
| Date of First Compliant Deposit: | 12 February 2018 | 
| Date of Acceptance: | 17 August 2016 | 
| Last Modified: | 13 Nov 2024 07:15 | 
| URI: | https://orca.cardiff.ac.uk/id/eprint/109058 | 
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