Passive components technology for THz-Monolithic Integrated Circuits (THz-MIC)

Eblabla, Abdalla ORCID: https://orcid.org/0000-0002-5991-892X, Benakaprasad, Bhavana, Li, Xu, Wallis, David ORCID: https://orcid.org/0000-0002-0475-7583, Guiney, Ivor, Humphreys, Colin and Elgaid, Khaled ORCID: https://orcid.org/0000-0003-3265-1097 2017. Passive components technology for THz-Monolithic Integrated Circuits (THz-MIC). Presented at: 18th International Radar Symposium (IRS), 2017, Prague, Czech Republic, 28-30 June 2017. Radar Symposium Conference Proceedings. pp. 1-7. 10.23919/IRS.2017.8008166

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Abstract

In this work, a viable passive components and transmission media technology is presented for THz-Monolithic Integrated Circuits (THz-MIC). The developed technology is based on shielded microstrip (S-MS) employing a standard monolithic microwave integrated circuit compatible process. The S-MS transmission media uses a 5-μm layer of benzocyclobutene (BCB) on shielded metalized ground plates avoiding any substrate coupling effects. An insertion loss of less than 3 dB/mm was achieved for frequencies up to 750 GHz. To prove the effectiveness of the technology, a variety of test structures, passive components and antennas have been design, fabricated and characterized. High Q performance was demonstrated making such technology a strong candidate for future THz-MIC technology for many applications such as radar, communications, imaging and sensing.

Item Type:	Conference or Workshop Item (Paper)
Date Type:	Published Online
Status:	Published
Schools:	Engineering
ISBN:	9783736993433
Last Modified:	22 Nov 2022 09:22
URI:	https://orca.cardiff.ac.uk/id/eprint/109462

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