Liu, Jun ORCID: https://orcid.org/0000-0002-4549-2833, Liu, Changqing and Conway, Paul P. 2008. Growth mechanism of copper column by electrodeposition for electronic interconnections. Presented at: 2nd Electronics System-Integration Technology Conference (ESTC 2008), Greenwich, England, 1-4 September 2008. 2008 2nd Electronics System-Integration Technology Conference. IEEE, pp. 679-684. 10.1109/ESTC.2008.4684432 |
Official URL: http://doi.org/10.1109/ESTC.2008.4684432
Abstract
Formation mechanism of copper columns by electrodeposition has been discussed by observing the evolution of surface morphology and microstructure of these columns electrodeposited from 16ms to 3 hours. Based on this study, a heuristic model is proposed to describe the growth mechanism of copper column which provides guidance for controlling microstructure of electrodeposited copper columns for fine pitch electronic interconnections. {\textcopyright}2008 IEEE.
Item Type: | Conference or Workshop Item (Paper) |
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Date Type: | Published Online |
Status: | Published |
Schools: | Engineering |
Publisher: | IEEE |
ISBN: | 9781424428144 |
Last Modified: | 09 Nov 2022 09:54 |
URI: | https://orca.cardiff.ac.uk/id/eprint/137554 |
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