Growth mechanism of copper column by electrodeposition for electronic interconnections

Liu, Jun ORCID: https://orcid.org/0000-0002-4549-2833, Liu, Changqing and Conway, Paul P. 2008. Growth mechanism of copper column by electrodeposition for electronic interconnections. Presented at: 2nd Electronics System-Integration Technology Conference (ESTC 2008), Greenwich, England, 1-4 September 2008. 2008 2nd Electronics System-Integration Technology Conference. IEEE, pp. 679-684. 10.1109/ESTC.2008.4684432

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Abstract

Formation mechanism of copper columns by electrodeposition has been discussed by observing the evolution of surface morphology and microstructure of these columns electrodeposited from 16ms to 3 hours. Based on this study, a heuristic model is proposed to describe the growth mechanism of copper column which provides guidance for controlling microstructure of electrodeposited copper columns for fine pitch electronic interconnections. {\textcopyright}2008 IEEE.

Item Type:	Conference or Workshop Item (Paper)
Date Type:	Published Online
Status:	Published
Schools:	Schools > Engineering
Publisher:	IEEE
ISBN:	9781424428144
Last Modified:	09 Nov 2022 09:54
URI:	https://orca.cardiff.ac.uk/id/eprint/137554

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