Menk, Alexander, Pearce, Chris J., Lanier, Olivier, Simpson, Robert Napier and Bordas, Stéphane Pierre Alain ![]() |
Abstract
Predicting the lifetime of solder joints undergoing thermal cycling is crucial for the electronics industry in order to guarantee a certain performance of their products in the field. Semi-empirical methods are often used to predict the average lifetime of the critical joints. However, to get a reliable failure probability the standard deviation must also be addressed. The deviation of the lifetime from the mean value is a consequence of the variation in microstructure found in actual joints. We therefore propose a new methodology that calculates crack growth based on microstructural features of the joint. A series of random microstructures is generated. Crack growth calculations are performed for each of these structures. The structural problem is solved numerically with the extended finite element method which allows a complete automation of the process. The mean crack length and standard deviation are calculated from the crack growth simulations and the result is compared to experimental data.
Item Type: | Conference or Workshop Item (Paper) |
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Date Type: | Publication |
Status: | Published |
Schools: | Engineering |
Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
Publisher: | IEEE |
ISBN: | 9781457701078 |
Last Modified: | 18 Oct 2022 13:49 |
URI: | https://orca.cardiff.ac.uk/id/eprint/15549 |
Citation Data
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