Lifetime prediction for solder joints with the extended finite element method

Menk, Alexander, Pearce, Chris J., Lanier, Olivier, Simpson, Robert Napier and Bordas, Stéphane Pierre Alain ORCID: https://orcid.org/0000-0001-8634-7002 2011. Lifetime prediction for solder joints with the extended finite element method. Presented at: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2011, 12th International Conferenc, Linz, Austria, 18-20 April 2011. 2011 12th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). New York: IEEE, pp. 113-120. 10.1109/ESIME.2011.5765773

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Abstract

Predicting the lifetime of solder joints undergoing thermal cycling is crucial for the electronics industry in order to guarantee a certain performance of their products in the field. Semi-empirical methods are often used to predict the average lifetime of the critical joints. However, to get a reliable failure probability the standard deviation must also be addressed. The deviation of the lifetime from the mean value is a consequence of the variation in microstructure found in actual joints. We therefore propose a new methodology that calculates crack growth based on microstructural features of the joint. A series of random microstructures is generated. Crack growth calculations are performed for each of these structures. The structural problem is solved numerically with the extended finite element method which allows a complete automation of the process. The mean crack length and standard deviation are calculated from the crack growth simulations and the result is compared to experimental data.

Item Type:	Conference or Workshop Item (Paper)
Date Type:	Publication
Status:	Published
Schools:	Engineering
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Publisher:	IEEE
ISBN:	9781457701078
Last Modified:	18 Oct 2022 13:49
URI:	https://orca.cardiff.ac.uk/id/eprint/15549

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