Huang, Tongde, Zhu, Xueliang, Wong, Ka Ming ![]() |
Abstract
Metal-oxide-semiconductor heterostructure field effect transistors (MOSHFETs) were fabricated with an AlN/GaN heterostructure grown on Si substrates. A 7-nm Al 2O 3 serving as both gate dielectric under the gate electrode and passivation layer in the access region was used. It was found that the Al 2O 3 was superior to SiN x in increasing the 2-D electron gas (2DEG) density and thereby reducing the access resistance. In addition, the off-state leakage current (I off) in these AlN/GaN MOSHFETs was reduced by four orders of magnitude to 7.6 × 10 -5 mA/mm as a result of the Al 2O 3 gate dielectric, compared to that of AlN/GaN HFETs. Meanwhile, the subthreshold slope was improved to a nearly ideal value of 62 mV/dec because of the extremely low I off. The MOSHFETs with 1-μm gate length exhibited good DC characteristics. A maximum drain current of 745 mA/mm and a peak extrinsic transconductance of 280 mS/mm were achieved
Item Type: | Article |
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Date Type: | Publication |
Status: | Published |
Schools: | Schools > Physics and Astronomy |
Publisher: | Institute of Electrical and Electronics Engineers |
ISSN: | 0741-3106 |
Last Modified: | 13 Jul 2023 15:31 |
URI: | https://orca.cardiff.ac.uk/id/eprint/155669 |
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