Preparation and characterisation of contacts for high temperature thermoelectric modules

Garcia Canadas, Jorge and Min, Gao ORCID: https://orcid.org/0000-0001-9591-5825 2012. Preparation and characterisation of contacts for high temperature thermoelectric modules. Presented at: 9th European Conference On Thermoelectrics: ECT2011, Thessaloniki, Greece, 28–30 September 2011. AIP Conference Proceedings: Volume 1449: D. Thermoelectric Modules. American Institute of Physics Conference Proceedings American Institute of Physics, pp. 454-457. 10.1063/1.4731594

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Abstract

In this paper we report the use of high temperature solder alloys that allow the fabrication of high temperature thermoelectric modules. As an initial approach, well-known Bi2Te3 thermocouples were fabricated using a 301 °C melting point solder alloy. Secondly, junctions of promising thermoelectric materials for high temperatures were prepared employing a 715 °C solder. The properties of the junctions are evaluated and the experimental procedure to obtain the contacts is described, providing a methodology for the fabrication of high-temperature thermoelectric modules.

Item Type:	Conference or Workshop Item (Paper)
Date Type:	Publication
Status:	Published
Schools:	Engineering
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Publisher:	American Institute of Physics
ISSN:	0094-243X
Last Modified:	24 Oct 2022 10:47
URI:	https://orca.cardiff.ac.uk/id/eprint/45844

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