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Fabrication of the SCUBA-2 detector arrays

Audley, Michael D., Duncan, William D., Holland, Wayne S., Walton, Anthony, Parkes, William, Dunare, Camelia, Gundlach, Alan, Stevenson, Tom, Irwin, Kent D., Hilton, Gene C., Schulte, Eric, Ade, Peter A. R. and Tucker, Carole 2004. Fabrication of the SCUBA-2 detector arrays. Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 520 (1-3) , pp. 483-486. 10.1016/j.nima.2003.11.379

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We describe the techniques used to fabricate SCUBA-2, the first large-format, filled array of bolometers for sub-millimeter astronomy. With two monolithic arrays of ∼10,000 bolometers, SCUBA-2 is made possible by a unique combination of advanced technologies. The detectors are made from thermally bonded and thinned silicon wafers whose surface is ion-implanted to match the impedance of free space. SCUBA-2s pixels are suspended on a View the MathML source silicon nitride membrane with low tensile stress. Deep-etch micromachining to View the MathML source by the Bosch process isolates each pixel thermally. Proximity effect transition edge sensors formed from Mo/Cu bilayers (Nucl. Instr. and Meth. A, these proceedings) are the temperature sensing elements for the bolometers. To read out such a large number of pixels, SCUBA-2 uses a superconducting quantum interference device readout for time domain multiplexing (Nucl. Instr. and Meth. A, these proceedings). The detector wafer is flip-chip bonded to the multiplexer wafer by indium bumps which provide electrical and thermal connections. The technologies that make SCUBA-2 possible have applications for large-format arrays from the submillimeter through the X-ray spectral regions.

Item Type: Article
Date Type: Publication
Status: Published
Schools: Physics and Astronomy
Subjects: Q Science > QB Astronomy
Uncontrolled Keywords: Microfabrication; Bolometer array; Bump bonding; Deep etching
Publisher: Elsevier
ISSN: 0168-9002
Last Modified: 04 Jun 2017 04:55

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