Audley, Michael D., Duncan, William D., Holland, Wayne S., Walton, Anthony, Parkes, William, Dunare, Camelia, Gundlach, Alan, Stevenson, Tom, Irwin, Kent D., Hilton, Gene C., Schulte, Eric, Ade, Peter A. R. ![]() ![]() |
Abstract
We describe the techniques used to fabricate SCUBA-2, the first large-format, filled array of bolometers for sub-millimeter astronomy. With two monolithic arrays of ∼10,000 bolometers, SCUBA-2 is made possible by a unique combination of advanced technologies. The detectors are made from thermally bonded and thinned silicon wafers whose surface is ion-implanted to match the impedance of free space. SCUBA-2s pixels are suspended on a View the MathML source silicon nitride membrane with low tensile stress. Deep-etch micromachining to View the MathML source by the Bosch process isolates each pixel thermally. Proximity effect transition edge sensors formed from Mo/Cu bilayers (Nucl. Instr. and Meth. A, these proceedings) are the temperature sensing elements for the bolometers. To read out such a large number of pixels, SCUBA-2 uses a superconducting quantum interference device readout for time domain multiplexing (Nucl. Instr. and Meth. A, these proceedings). The detector wafer is flip-chip bonded to the multiplexer wafer by indium bumps which provide electrical and thermal connections. The technologies that make SCUBA-2 possible have applications for large-format arrays from the submillimeter through the X-ray spectral regions.
Item Type: | Article |
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Date Type: | Publication |
Status: | Published |
Schools: | Schools > Physics and Astronomy |
Subjects: | Q Science > QB Astronomy |
Uncontrolled Keywords: | Microfabrication; Bolometer array; Bump bonding; Deep etching |
Publisher: | Elsevier |
ISSN: | 0168-9002 |
Last Modified: | 24 Oct 2022 10:56 |
URI: | https://orca.cardiff.ac.uk/id/eprint/46454 |
Citation Data
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