Cardiff University | Prifysgol Caerdydd ORCA
Online Research @ Cardiff 
WelshClear Cookie - decide language by browser settings

Bonding of glass chip based SPR sensors to thermoplastic microfluidics scaffolds

Auerswald, J., Niedermann, P., Dias, F., Keppner, H., Bigot, Samuel ORCID: https://orcid.org/0000-0002-0789-4727, Beckers, M. C., Nestler, J., Hiller, K., Gessner, T. and Knapp, H. F. 2007. Bonding of glass chip based SPR sensors to thermoplastic microfluidics scaffolds. Presented at: Smart Systems Integration 2007, Paris, France, 27-28 March 2007.

Full text not available from this repository.
Item Type: Conference or Workshop Item (Paper)
Date Type: Completion
Status: Unpublished
Schools: Engineering
Centre for Advanced Manufacturing Systems At Cardiff (CAMSAC)
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Last Modified: 25 Oct 2022 08:00
URI: https://orca.cardiff.ac.uk/id/eprint/51068

Actions (repository staff only)

Edit Item Edit Item