Auerswald, J., Niedermann, P., Dias, F., Keppner, H., Bigot, Samuel ORCID: https://orcid.org/0000-0002-0789-4727, Beckers, M. C., Nestler, J., Hiller, K., Gessner, T. and Knapp, H. F. 2007. Bonding of glass chip based SPR sensors to thermoplastic microfluidics scaffolds. Presented at: Smart Systems Integration 2007, Paris, France, 27-28 March 2007. |
Item Type: | Conference or Workshop Item (Paper) |
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Date Type: | Completion |
Status: | Unpublished |
Schools: | Engineering Centre for Advanced Manufacturing Systems At Cardiff (CAMSAC) |
Subjects: | T Technology > TA Engineering (General). Civil engineering (General) |
Last Modified: | 25 Oct 2022 08:00 |
URI: | https://orca.cardiff.ac.uk/id/eprint/51068 |
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