Bonding of glass chip based SPR sensors to thermoplastic microfluidics scaffolds

Auerswald, J., Niedermann, P., Dias, F., Keppner, H., Bigot, Samuel ORCID: https://orcid.org/0000-0002-0789-4727, Beckers, M. C., Nestler, J., Hiller, K., Gessner, T. and Knapp, H. F. 2007. Bonding of glass chip based SPR sensors to thermoplastic microfluidics scaffolds. Presented at: Smart Systems Integration 2007, Paris, France, 27-28 March 2007.

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Item Type:	Conference or Workshop Item (Paper)
Date Type:	Completion
Status:	Unpublished
Schools:	Schools > Engineering Research Institutes & Centres > Centre for Advanced Manufacturing Systems At Cardiff (CAMSAC)
Subjects:	T Technology > TA Engineering (General). Civil engineering (General)
Last Modified:	25 Oct 2022 08:00
URI:	https://orca.cardiff.ac.uk/id/eprint/51068

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