Aboush, Z., Benedikt, Johannes  ORCID: https://orcid.org/0000-0002-9583-2349, Priday, J. and Tasker, Paul ORCID: https://orcid.org/0000-0002-6760-7830
2006.
DC-50 GHz low loss thermally enhanced low cost LCP package process utilizing mico via technology.
Presented at: 2006 IEEE Microwave Symposium,
San Francisco, USA,
pp. 961-964.
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| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Schools: | Schools > Engineering |
| Last Modified: | 17 Oct 2022 10:16 |
| URI: | https://orca.cardiff.ac.uk/id/eprint/7594 |
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