DC-50 GHz low loss thermally enhanced low cost LCP package process utilizing mico via technology

Aboush, Z., Benedikt, Johannes ORCID: https://orcid.org/0000-0002-9583-2349, Priday, J. and Tasker, Paul ORCID: https://orcid.org/0000-0002-6760-7830 2006. DC-50 GHz low loss thermally enhanced low cost LCP package process utilizing mico via technology. Presented at: 2006 IEEE Microwave Symposium, San Francisco, USA, pp. 961-964.

Full text not available from this repository.

Item Type:	Conference or Workshop Item (Paper)
Schools:	Engineering
Last Modified:	17 Oct 2022 10:16
URI:	https://orca.cardiff.ac.uk/id/eprint/7594

Actions (repository staff only)

Edit Item