Block compressive sensing for solder joint images with wavelet packet thresholding

Zhao, Hui-Huang, Rosin, Paul ORCID: https://orcid.org/0000-0002-4965-3884 and Lai, Yukun ORCID: https://orcid.org/0000-0002-2094-5680 2019. Block compressive sensing for solder joint images with wavelet packet thresholding. IEEE Transactions on Components and Packaging Technologies 9 (6) , pp. 1190-1199. 10.1109/TCPMT.2019.2907106

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Abstract

This paper provides a novel method that can achieve better results in solder joint imagery compression and reconstruction. Wavelet packet decomposition is used to generate some frequency coefficients of images. The higher and lower frequency coefficients of the reconstruction signal are used separately to improve the reconstruction performance. A threshold that only relates to the higher frequency coefficients is defined to remove the noise in the reconstruction result in each iteration. A new control factor is further defined to control the threshold value. The control factor relates to the wavelet packet low-frequency coefficients and is updated by the wavelet packet low-frequency coefficients in each iteration. The experimental results reveal that the proposed algorithm is able to improve the performance in terms of peak signal-to-noise ratio (PSNR) and structural similarity (SSIM) compared with classical algorithms in reconstruction of different types of solder joint images. When the sample rate is increased, the proposed method improves the reconstruction results and maintains low computational cost. The proposed algorithm can retain more image structure and achieve better results than some common methods.

Item Type:	Article
Date Type:	Publication
Status:	Published
Schools:	Computer Science & Informatics
Publisher:	Institute of Electrical and Electronics Engineers (IEEE)
ISSN:	2156-3950
Date of First Compliant Deposit:	26 March 2019
Date of Acceptance:	4 March 2019
Last Modified:	08 Nov 2024 03:00
URI:	https://orca.cardiff.ac.uk/id/eprint/121137

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