3D Ultra miniature MMIC TFMS 90° coupler fabricated with a standard air bridge process

Hettak, K. and Elgaid, K. ORCID: https://orcid.org/0000-0003-3265-1097 2011. 3D Ultra miniature MMIC TFMS 90° coupler fabricated with a standard air bridge process. Presented at: 41st European Microwave Conference, 10-13 October 2011. 2011 41st European Microwave Conference. IEEE, -. 10.23919/EuMC.2011.6101979

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Abstract

This paper proposes and demonstrates a new scheme for realizing a compact 3D 90° hybrid coupler based on compact meandered air thin-film microstrip (air TFMS) transmission line sections made using a standard air bridge multi-layer InP process. This new type of air TFMS is suspended using air bridges providing a small air gap between the signal line and ground metal. The proposed coupler takes advantage of the multi-level metallization processes offered in InP technology. The intrinsic area of the fabricated 3D hybrid coupler is significantly reduced and has shown a size reduction of 80% in circuit area at 15 GHz as compared to that of a conventional hybrid coupler using the TFMS configuration. Simulated and experimental results are presented in support of the novel 3D compact coupler.

Item Type:	Conference or Workshop Item (Paper)
Date Type:	Published Online
Status:	Published
Schools:	Engineering
Publisher:	IEEE
ISBN:	9781612842356
Last Modified:	04 Nov 2022 12:17
URI:	https://orca.cardiff.ac.uk/id/eprint/122517

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