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Growth mechanism of copper column by electrodeposition for electronic interconnections

Liu, Jun ORCID:, Liu, Changqing and Conway, Paul P. 2008. Growth mechanism of copper column by electrodeposition for electronic interconnections. Presented at: 2nd Electronics System-Integration Technology Conference (ESTC 2008), Greenwich, England, 1-4 September 2008. 2008 2nd Electronics System-Integration Technology Conference. IEEE, pp. 679-684. 10.1109/ESTC.2008.4684432

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Formation mechanism of copper columns by electrodeposition has been discussed by observing the evolution of surface morphology and microstructure of these columns electrodeposited from 16ms to 3 hours. Based on this study, a heuristic model is proposed to describe the growth mechanism of copper column which provides guidance for controlling microstructure of electrodeposited copper columns for fine pitch electronic interconnections. {\textcopyright}2008 IEEE.

Item Type: Conference or Workshop Item (Paper)
Date Type: Published Online
Status: Published
Schools: Engineering
Publisher: IEEE
ISBN: 9781424428144
Last Modified: 09 Nov 2022 09:54

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