Influence of the microstructure on the stress state of solder joints using thermal cycling

Menk, A. and Bordas, Stephane Pierre Alain ORCID: https://orcid.org/0000-0001-8634-7002 2009. Influence of the microstructure on the stress state of solder joints using thermal cycling. Presented at: Proceedings of EuroSimE 2009, Delft, The Netherlands,

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Item Type:	Conference or Workshop Item (Paper)
Schools:	Schools > Engineering
Last Modified:	18 Oct 2022 14:13
URI:	https://orca.cardiff.ac.uk/id/eprint/16828

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