Rapid planarization of polycrystalline diamond by laser with response surface methodology

Ye, Sheng, Zhao, Shangman, Shao, Siwu, Chen, Liangxian, Zheng, Yuting, Liu, Jinlong, Sedov, Vadim, Mandal, Soumen ORCID: https://orcid.org/0000-0001-8912-1439, Li, Chengming and Wei, Junjun 2025. Rapid planarization of polycrystalline diamond by laser with response surface methodology. Optics and Laser Technology 180 , 111509. 10.1016/j.optlastec.2024.111509

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Abstract

Microsecond-pulsed fiber laser was employed for the surface planarization processing of large-scale freestanding polycrystalline diamond. The effects of process parameters, including rotational processing speed, pulse duration, duty cycle, and line spacing, on the processing outcomes were investigated using statistical approach, specifically, response surface methodology (RSM). As for surface roughness (R), the influence of pulse width was more important than duty cycle and line spacing, while rotational processing speed hardly presented significant influence; however, for material removal rate (S), the impact of line spacing is most pronounced. The laser processing of diamond led to a graphitization, while the observed sputtering of small particles at the laser focus identified as the primary cause for high removal rates. The developed high-energy laser planarization system demonstrated capability in processing of large 4-inch diamond wafers, presenting an effective technology for achieving both higher-quality surfaces and elevated removal rates simultaneously in comparison to mechanical grinding methods.

Item Type:	Article
Date Type:	Publication
Status:	Published
Schools:	Physics and Astronomy
Publisher:	Elsevier
ISSN:	0030-3992
Date of Acceptance:	20 July 2024
Last Modified:	01 Aug 2024 10:30
URI:	https://orca.cardiff.ac.uk/id/eprint/171063

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