Liu, Shangfeng, Ratiu, Bogdan-Petrin, Jia, Hui, Yan, Zhao, Wong, Ka Ming, Martin, Mickael, Tang, Mingchu, Baron, Thierry, Liu, Huiyun and Li, Qiang ![]() ![]() |
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Abstract
In this work, we report InAsP-based dislocation filter layers (DFLs) for InP heteroepitaxy on CMOS-standard (001) Si substrates, demonstrating a threading dislocation density of 3.7 × 107 cm−2. The strain introduced by InAsP induces dislocation bending at the InAsP/InP interface, thereby facilitating the reaction and annihilation of dislocations during their lateral glide. Concurrently, the InP spacer exhibits tensile strain, leading to the formation of stacking faults (SFs). With a comprehensive analysis utilizing x-ray diffraction, electron channeling contrast imaging, and transmission electron microscopy, the effects of DFL-induced strain on dislocations and SFs are investigated. Fine-tuning the strain conditions allowed low-dislocation-density while SF-suppressed, anti-phase boundary free InP on Si. This work, therefore, provides a useful buffer engineering scheme for monolithic integration of InP-based electronic and photonic devices onto the industry-standard silicon platform.
Item Type: | Article |
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Date Type: | Published Online |
Status: | Published |
Schools: | Physics and Astronomy |
Publisher: | American Institute of Physics |
ISSN: | 0003-6951 |
Funders: | EPSRC |
Date of First Compliant Deposit: | 20 August 2024 |
Date of Acceptance: | 8 August 2024 |
Last Modified: | 21 Aug 2024 13:00 |
URI: | https://orca.cardiff.ac.uk/id/eprint/171505 |
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