Application of a novel active envelope load pull architecture in large signal device characterisation

Williams, T., Benedikt, Johannes ORCID: https://orcid.org/0000-0002-9583-2349 and Tasker, Paul J. ORCID: https://orcid.org/0000-0002-6760-7830 2005. Application of a novel active envelope load pull architecture in large signal device characterisation. Presented at: 35th European Microwave Conference, Paris, France,

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Item Type:	Conference or Workshop Item (Paper)
Schools:	Engineering
Last Modified:	19 Oct 2022 09:34
URI:	https://orca.cardiff.ac.uk/id/eprint/21521

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